Consider an electronic enclosure shaped as a duct with a cross section of 500 mm x 50 mm and length of 300 mm. Let's assume that all the heat dissipating components are located on two 300 mm x 500 mm similar boards that are attached to the top and bottom surfaces of the duct. Let's approximate the enclosure as a duct with constant surface temperature and assume the flow is fully developed. Air with mass flow rate of 0.05 kg/s and inlet temperature of Ti = 40 degrees Celsius enters the duct and leaves it with a temperature of Tc = 50 degrees Celsius. What is the total heat transfer rate to the air inside the duct?